www.davidson.com.au - Buehler Materials Preparation & Analysis

SEM or TEM Specimen Preparation
Precision Angle Levelling Adjuster Allows Tilt Alignment to Critical Die Structures
Only the Sample Touches the Wheel thus Minimizing Contaminants, Maintaining Critical Alignment, and Maximizing Consumable Life
SEM Paddles Premit Specimen Removal, Examination, then Reattachment to Polishing Fixture Without Loss of Plane
Precision 8" (203mm) Plain Glass and Frosted Glass Wheels Included
Particle Catcher and Weight Remove Polishing Swarf Preventing Die Damage
Accessory Microscope/Metallograph Stage Adapter

The MicroPrecise Integrated Circuit Cross-Sectioning Kit has been engineered to quickly and precisely cross-section die samples to specific features of interest. Unlike other die cross-sectioning systems, the MicroPrecise allows only the die to touch the polished wheel. Thus, the specimen maintains critical alignment throughout the polishing operation.

This innovative design also reduces polishing time, debris, and extends consumable life. A precision angle levelling adjuster allows tilt alignment for polishing critical die features. The system also includes two specially weighted polishing fixtures: a stainless steel holder for large dies or ceramic specimens, and a lighter aluminium holder for smaller dies and gallium arsenide applications. An accessory weight set provides additional load application flexibility.