|
division of BIOLAB |
|
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Buehler Materials Preparation & Analysis
MicroPrecise Parallel Lapping Kit for Bare Die Lapping
|
|
Features & Benefits
|
The MicroPrecise Parallel Lapping Kit mechanically removes thin layers on die surfaces. It is designed to reveal gate oxide damage, metal shorts, or other defects. The MicroPrecise features a lockable micrometer-based lapping fixture that applies a controlled uniform pressure to the fluid-filled mounting diaphragm to guarantee consistent material removal. The multi-speed motor adds further control of removal rates and uniformity while specially sized spacers provide die support.