www.davidson.com.au - Buehler Materials Preparation & Analysis

Semi-Automatic System designed to accurately cross-section a pre-specified point in an Integrated Circuit (IC) specimen
Accurate cross-sectioning within ± 1 micron of target feature eliminates fear of grinding beyond the plane of interest
Reduce the number of grinding steps resulting in increased specimen through put and productivity
Accessory microscope makes specimen tilt alignment simple
Remote Digital Display provides the freedom to position the micrometer readout in a convenient place, while enlarging the display or enhanced readability
Variable speed motor of 1-50 rpm

The MPC™ 2000 Integrated Circuit Cross-Sectioning System is designed to accurately remove a pre-specified amount of material from a microelectronic sample without the need for operator intervention. Accurate cross-sectioning within +/-1μm of a target feature is possible due to
high precision provided by a combination of the precision power head, the low-runout drive plate, and the lapped, stainless-steel platen. This high accuracy reduces the possibility of grinding beyond the target plane.

The benefits of such accuracy include a reduced number of grinding steps resulting in greater sample throughput: A rough grind is used to bring the plane of polish to within a few microns of the target, and a fine grind is then used to section into the target feature itself. Subsequent polishing can then be performed to remove any remaining scratches. Another feature, unattended operation, saves time by allowing the user to walk away and perform other tasks.