Buehler Materials Preparation & Analysis

MPC™ 3000 Micro Precise Back-Side Grinding System

The MPC™ 3000 offers the micro-electronic analyst a better means of backside thinning flip chip devices for thermal emission studies. Automated levelling features simplify alignment between die and abrasive surfaces to eliminate the tilt adjustment necessary with other systems. Other ‘ease of use’ features include digital micrometer adjustment to control sample height for a positioning accuracy of ±2.5μm; diamond down-stops which ensure removal of only the desired quantity of material; vacuum mounting of the specimen to facilitate easy sample inspection; and a corrosion resistant, precision lapped, stainless grinding wheel.